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These processes have been developed to mass-produce vias without drills. Surface Laminar Circuits (SLCs). The most notable MLB technology developed to form vias is the sequential fabrication of multilayers without press operations. This is particularly important for surface blind via holes. The process for fabricating a board using surface laminar circuits is as follows (see Fig. 5.5): Innerlayer ground and power distribution patterns are formed. Panel receives an oxide treatment. Insulating photosensitive resin is coated over the panel by curtain or screen-coating methods. Holes are formed by photoexposure and development. Panel is metallized by usual copper reduction process (consisting of catalyzing and electroless copper plating or by direct metallization process). 6. Thicker deposition of copper is made by continuation of electroless copper plating or galvanic plating. 7. Circuit patterns are formed by dry film tenting process. 1. 2. 3. 4. 5.

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ADF Business Components is itself based on three main building blocks, as shown in Figure 4-1: the entity object, the view object, and the application module. You might be thinking, What, more layers and you would be right; however, each layer of ADF Business Components has a well-defined role, and being separate and distinct makes it much more flexible and powerful. The entity object maps directly to a database table and acts as an application cache for records from that table. The view object defines an application-specific view of records queried into the underlying entity objects. The final building block is a container called an application module, which is a collection of instances of view objects that defines the data model and transaction for a particular business task.

FIGURE 5.5 Example of surface laminar circuit (SLC) board cross section. (Courtesy IBM Yasu and Ciba-Geigy Limited.)

DYCOstrate . A different approach to small via creation has been taken by Dyconex AG of Switzerland. After ground and power patterns are formed on the panel, and the panel is oxide-treated, polyimide-backed copper foil is laminated on the panel. Holes in the copper are formed by a chemical etching process, and the insulating polyimide material underneath the holes is removed by plasma etching. PWBs made in such a way are called DYCOstrate. In other, similar technologies, different dielectric materials are used, and they are removed by alkaline solutions.The rest of the process is similar to that for SLC; that is, holes are metallized and a thick copper deposition is made by electroless or galvanic plating, and the circuit pattern is formed by a tent-and-etch process (see Fig. 5.5). Drilled Vias. In both SLC and DYCOstrate cases, through-holes can also be made by conventional drilling and plating processes, in addition to the surface blind via holes. Cost Impact. The manufacturing cost of these sequential technologies is not necessarily directly cheaper than conventional MLB technology, which depends on a laminating press operation. However, since the cost of making standard holes in a board can be as high as 30 percent of the total manufacturing cost, and the creation of holes in these processes is comparatively inexpensive, the overall cost for equivalent functionality can be less. In addition, the fine pattern capability for this process is excellent. For example, an eight-layer conventional structure can often be reduced to a four-layer structure, reducing the total cost for the same packaging density.