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Brazing and soldering involve the use of a filler metal (brazing compound or solder), which has a significantly lower melting point than the basis metals associated with the two bonding surfaces. The filler material must be able to alloy with the surfaces to be joined. As the filler is heated to liquidus, there is near-surface metallurgical dissolution and mixing (alloy formation) with the contacted bonding surfaces. Continued heating above the liquidus temperature of the filler metal results in its further spreading and alloying via molten metal surface tension effects.As the bonding surfaces are cooled, the filler metal returns to solidus and a bonded assembly results. There are only subtle differences between soldering and brazing, the primary distinction being the temperature required for joint formation. Brazing is generally accomplished at a relatively high temperature (>450 C) as compared to soldering. (There is no consensus in the literature, but values between 400 C and 500 C are commonly sited.) Brazing temperatures would be detrimental to most electronic components and PWBs. Since circuit board assembly is done almost exclusively by means of soldering at temperatures generally below 260 C, this chapter is devoted to that traditional joining method.

Solder is the cement that joins lead to pad, imparts the mechanical robustness required for a reliable assembly, and also possesses the electrical conduction needed for circuitry Generally composed of an alloy of metals, it is chosen to melt at a temperature compatible with other materials associated with the soldered assembly Once molten, the solder must wet the component lead and bond pad Upon solidification, the resultant solder joint must provide bond strength to survive differences in thermal expansion rates of the associated component assembly There must be compatibility of the solder alloy and related materials to requirements for assembly and service at elevated operating temperatures as well as resistance to mechanical shock and vibration Since the start of electronics, Sn-Pb has been the dominant solder alloy choice Its eutectic alloy possesses a relatively modest liquidus temperature (183 C) and a working range typically about 205 to 230 C.

This overage in temperature by about 20 to 50 C is applied to ensure that all parts have achieved a temperature commensurate with good solder wetting It also may be necessary to reach such temperatures on thermally massive boards where the lightest parts may heat quickly while the most thermally aggressive parts may just barely achieve a temperature adequate for good solder wetting Everything in the electronics industry has been tailored to working in that temperature regime ICs and passive components, laminates, and process equipment associated with soldering have been qualified for use at those temperatures Now, due to the EU s RoHS directive and similar legislation elsewhere in the world, Sn-Pb is being phased out from mainstream electronics manufacturing Only a small fraction of printed circuit assemblies (PCAs) will remain as Pb d solder assemblies as permitted by RoHS exclusions and exempted military applications.

We are using a 5 MHz external crystal and a 2 multiplier for a 10 MHz operation. All the constants are defined up front on top of the program. This makes it easy to

As time progresses, it will become increasingly difficult to source Pb-bearing parts for use with RoHS Pb-exempt circuitry There are no drop-in replacement solders for Sn-Pb Although there are many candidates, the most widely considered alloys require higher process temperatures and necessitate changes to components, circuit board laminates, and even process equipment..

Although these chapters will give great emphasis to Pb-free solders and soldering, it is best to demonstrate soldering process dynamics with Sn-Pb solder, for a couple of important reasons: first, it is our best understood metallurgical system, and second, it is a binary alloy with predictable bonding attributes. It will benefit the reader first to have a good understanding of this

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relatively simple alloy system. The case presented will be based upon eutectic Sn-Pb solder (63 wt percent Sn and 37 percent Pb) in contact with solderable and non-solderable coatings on a basis metal. Primary soldering steps include:

Intimate contact of the solder to materials being joined Slow application of heat to warm the parts to be soldered Oxide removal from the joining surfaces and solder metallurgies Application of heat sufficient to melt the solder Solder wetting to joining surfaces and intermetallic formation Quenching of the solder liquidus

There are a few other materials that need to be covered for this discussion. The first is solder paste. This is a mixture of minute solder beads, flux, and other materials to give it specific rheological characteristics for dispensing and chemical agents for metal surface preparation. For surface-mount applications, it is typically stenciled onto PWB bonding pads, and then the electronic component is placed upon the solder paste deposit. The paste holds the component in place during the reflow process. The second is flux, which, as mentioned previously, is a key component of solder paste. The flux is a heat-activated chemical agent used to clean solderable surfaces. Both paste and flux will be covered in subsequent sections of this chapter.