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Code 39, also known as USS Code 39, USS 39, Code 3/9, 3 of 9 Code and USD-3, is the first alphanumeric linear barcode in the word used in non-retail environment. It is compatible with many government barcode specifications, including the U.S. Department of Defense and HIBCC.

Of the 90 naturally occurring elements, only 13 can be practically combined with each other to form a practical solder (see Fig. 45.1).

Summary

FIGURE 45.1 Highlighted elements can be combined to form solders useful for circuit board assembly.

Of those elements that can combine to form solders, several have limitations that restrict their practical implementation for solder use (see Table 45.2). Gallium, gold, indium, platinum, and palladium cannot be mined or refined in sufficient quantity to satisfy the needs of the electronics industry and are prohibitively expensive, blocking their consideration as a major constituent of a worldwide solder supply. The Bismuth (Bi) supply, a by-product of lead refining, would be marginally sufficient. Mercury and antimony are too toxic. Both mercury and Pb are already on the EU s RoHS list of restricted materials. Gallium and mercury possess too low a melting point to be used on their own. This leaves five metals for practical solder alloy consideration: bismuth (Bi), copper (Cu), silver (Ag), tin (Sn), and zinc (Zn). Due to

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TABLE 45.2 Elemental Candidates for Solders Element Antimony Bismuth Copper Gallium Gold Indium Lead Mercury Palladium Platinum Silver Tin Zinc Symbol Sb Bi Cu Ga Au In Pb Hg Pd Pt Ag Sn Zn Melting point ( C) 630.5 217.5 1084.5 29.75 1063 156.3 327.5 38.83 1550 1768.3 960.15 231.89 419.6 Comments Toxic, used as a minor constituent of some solders Already in use Already in use Too expensive Too expensive Too expensive Banned for use in EU Toxic, restricted for use in EU Too expensive Too expensive Expensive but already used in solders in small quantities Already in use Already in use

its value, silver, too, can be used only in small proportions for solder and is already in wide use that way today. Given the four remaining metals (Bi, Cu, Sn, and Zn), there are many possible metallurgical permutations available for solder alloying, but there are few that either possess low enough liquidus to be useful for circuit board assembly or have attractive physical properties as a solder. Although Pb-free solders have been in use for many years (jewelry making, plumbing, brazing, etc.), few have been studied sufficiently for electronics assembly, most have too high a melting point to be useful, and none come with the well-documented properties database as is the case for Sn-Pb solder.

Candidate Pb-Free Solders Although many manufacturers completed the conversion to Pb-free soldering in time for the July 1, 2006, implementation of the RoHS directive in Europe, there was still no consensus across the industry for a single tin-lead solder replacement at the time. Pb-free alloy systems receiving the most attention include those listed in the Table 45.3.

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