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Figure 453 demonstrates the process temperature differences for Sn-Pb soldering compared to SAC A condition known as sporadic brittle fracture has been reported and may be related to the use of SAC alloy soldered to electroplate gold over electroplate nickel It is most often associated with BGA solder ball-to-BGA package attach, but may also occur in board-level solder joints at the BGA ball-PWB interface The root cause of failure is still unknown 45514 Sn-07Cu Alloy Eutectic Sn-Cu (mp, 227 C) is being used as a wave solder charge material It is compatible with most board surface finishes and component lead-frame finishes Its relatively low cost (about 50 percent more than Sn-Pb solder) makes it an attractive Pb-free alternative It also has been demonstrated to be an effective alloy for Pb-free hotair solder-leveled (HASL) surfaces on PWBs.

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One problem with Sn-Cu alloy, especially at wave soldering or fountain soldering, is that small amounts of dissolved copper will cause a dramatic rise in the melting point of the alloy The high melting temperature of this alloy causes rapid material dissolution from PWB surfaces and component lead platings Care must be taken to top off the wave solder pot with an appropriate amount of Sn or Sn-Cu to maintain proper Sn-Cu alloy proportions 45515 Indium Alloys This metal and its effect on the solder joint is very much the same as for bismuth Indium (In) is very soft and ductile in its elemental form and melts at about 157 C In-based soldering alloys are much more expensive about 25 times that of Sn-Pb due to indium s scarcity, thus it is not suited as a dominant metal in solder.

Price and supply make it unattractive even as a trace agent or a minor solder alloy constituent10 B Allenby et al11 concluded that the world s indium supply would be depleted in about one year if indium were consumed at the same rate as Pb An In-Sn eutectic occurs at 58 wt percent In with a eutectic point temperature of 120 C It forms intermetallic compounds with copper from the circuit board s bonding pad or copperbased component leads Copper is highly soluble in indium12 Indium has been demonstrated to be of value in reducing the leaching of gold into solder F Yost13 reported a lower Au dissolution rate for indium-based solders as compared to Sn solders The use of indium allows soldering to gold films without thoroughly consuming the gold.

The resulting solder joints are not brittle, as is the case of Sn-based solder joints exposed to too much gold..

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Indium and some of its alloys can wet to glass, quartz, and other normally unsolderable inorganic substrates with the aid of an ultrasonic soldering tool. Ultrasonic soldering will be discussed in the chapter on soldering techniques. 45.5.1.6 Zinc Solders. Zinc (Zn) alloys, favored by some Japanese companies, oxidize rapidly. Solder paste shelf-life has been an issue even when these alloys are refrigerated at very low temperatures. Dross formation in wave soldering has also been problematic. Zn alloys are also known to have some corrosion problems.

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