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Most every circuit board consists of a stack-up of insulator material such as fiberglass and conductive layers composed of copper. Copper oxidizes quickly and its oxides are somewhat chemical-resistant, making it tough to solder without aggressive fluxing. Copper also corrodes in the long term from left-over process residues, fingerprints (body salts), or airborne contaminants. It is for these reasons that copper traces and solder lands on circuit boards are protected by solder mask, plating, or other surface treatments. The following section covers the most common board finishes. The process engineer needs to bear in mind that in addition to solderability, other surface finish related issues may affect manufacturing or cost, including the following:

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Probe-ability This is the ease with which conventional in-circuit test probes are able to penetrate surface oxides or solder flux residue. Tribology The frictional properties of a material become important for press-fit connections. Cost Some surface finishes are significantly more expensive than others. Shelf-life This is the ability of a surface finish to resist oxidation or other surface conversion or corrosion and remain solderable. Reliability This refers to the resultant solder joint strength as it relates to long-term use and resistance to shock, vibration, and other environmental factors. Corrosion resistance Some surface finishes are more prone to corrosion than others. Immersion silver and copper are two such finishes. Other surface finish related defects Immersion silver (Imm-Ag) sometimes exhibits linear arrays of microvoids at the intermetallic interface which detracts from solder joint strength. Electroless nickel/immersion gold (ENIG) sometimes results in brittle fracture if the plating chemistries are not maintained properly.

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Hot Air Solder Leveled Surfaces HASL coated boards have been the industry mainstay and the most common board surface finish worldwide. HASL is generally eutectic or near-eutectic Sn-Pb flowed onto exposed surface pads and traces on a finished PWB at the board shop prior to electronic assembly. It is inexpensive, eminently solderable, and easy to apply, and has excellent shelf-life/aging properties.There is the old adage in the industry that nothing solders like solder, which has made HASL a safe and preferred finish for many years. Previously it was thought that the HASL process could not deliver flat enough pads for fine-pitch surface-mount. Now it is a wellproven surface finish for component lead pitches down to at least 0.5 mm. Reputable board shops no longer consider HASL difficult to apply. RoHS for the most part marks the impending demise of the Sn-Pb HASL surface finish. There are efforts to find other metallurgies to extend the useful life of HASL equipment.

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Sn-Cu has been demonstrated to be one such HASL coating material Studies are underway to determine long-term reliability impact of this change in material on the board and resultant solder joints 4562 Organic Solder-Preservative-Copper Known as OSP-Cu,14,15 organic solder-preservative-copper is a treatment and organic coating applied to the copper lands on the PWB at the board shop The lands are first given a microetch to remove oxides and to increase surface area for OSP coating adhesion The protective coating is an organometallic compound such as benzotriazole or imidazole, that chemically bonds with the freshly etched copper bonding pads and PTHs of the PWB The coating retards copper oxidation and is meant to retain copper solderability through multiple reflow cycles OSP-Cu is widely used and best for just-in-time board assembly strategies since its useful life is time-, temperature- and humidity-dependent.

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During the soldering process, the organic coating degrades with each reflow cycle, allowing increasing levels of copper oxidationThe chemical-resistant copper oxide inhibits solder wetting, requiring ever stronger solder fluxes This is particularly the case with thick {236 mm (0093 in) or greater}, thermally aggressive boards with mixed-mount technology Reflow results on the secondary side and primary side of such boards are generally satisfactory But by the time such a board goes through wave soldering, the OSP coating has largely lost its effectiveness in preventing copper oxidation and incomplete barrel fill may result on PTH component soldering When solder paste printing goes awry and the PWB needs to be cleaned of the misprinted or smeared solder paste, most organic solvents used for removing the paste can remove, thin, or react with the OSP coating reducing its effectiveness in preventing copper oxidation.

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