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In this case, the flux will not have the benefit of longer exposure times and higher process temperatures to assist in its job of oxidation removal Higher-temperature alloys require fluxes that can withstand higher process temperature for reflow It must not volatilize or decompose too rapidly nor polymerize or char at temperatures commensurate with soldering Some metals are more prone to oxidation than others Bismuth and zinc used in solder and copper on circuit boards are notable examples that may require a more active flux A nitrogen-rich environment is helpful in augmenting flux performance (See also Chap 43, Fluxes and Cleaning ).

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The ideal flux would be one that is potent, requires only a small quantity, leaves little or no residue (and what residue does remain would be thin, transparent, nonreflective), easily penetrated by in-circuit test probes, electrically insulating, and chemically inert. If not inert, it should be easily and completely removable in an inexpensive solvent. However, this is far from actual materials and process reality. Flux must be applied in sufficient quantity for thorough oxide removal and to avoid both metal reoxidation and flux exhaustion prior to solder wetting. Some post-soldering flux residues or form by-products may have deleterious effects on the circuit assembly since they may be chemically reactive and result in corrosion of exposed metals over the long term (see Fig. 46.3). The corrosive agents can be electrically conductive, resulting in electrical leakage (soft shorts) between closely spaced, oppositely charged conductors on the circuit board surface exacerbated by the residue s hygroscopic moisture uptake from the atmosphere. Corrosion may be augmented either by natural electromagnetic field (EMF) couples between two different metals or electrochemically driven by a charge between two adjacent conductors. The metallic ions, electrochemically driven, can plate out as metal dendrites on the surface of the board and produce intermittent or even persistent hard short circuiting (see Fig. 46.3). Flux must be heated to a temperature to allow the best reactive conditions without drying out or denaturing. For the sake of economy and cleaning, a thin application is necessary and should be confined to the bonded site(s) of interest.

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FIGURE 46.3 Corrosion dendrites caused by corrosive, hygroscopic flux residues. (Courtesy of Hewlett-Packard.)

Not all the projects are completed 100 percent, so you have the challenge to complete them Appropriate information and hints are provided The fourth part of the book is composed of appendixes that provide you with supplemental information you will find helpful in using the device This includes the hardware and software resources needed for the experiments we undertake Where special items are needed, I have made arrangements to provide them on my website at Encodergeekcom..

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The 1989 adoption of the Montreal Protocol2 imparted far-reaching changes to electronic manufacturing. In the circuit board assembly arena, it drove the elimination of chlorofluorocarbons and the reduction of volatile organic compounds for earth s ozone layer preservation. Many fluxes that used volatile organics such as alcohols were reformulated to use water as their solvent. Solvent-clean fluxes, which required non-aqueous cleaning chemicals (alcohols, chlorofluorocarbons [CFCs], hydochlorofluorocarbons [HCFCs], etc.), were practically eliminated from the marketplace. Today only two flux categories are in widespread use for PCB assembly: water-clean and no-clean. The former leaves a residue that must be removed from the PCA; otherwise, corrosion will set in. The latter, as the name implies, leaves a benign residue that is meant to be left on the circuit board. In fact, some no-clean residues perform as a conformal coating shielding the board from moisture and atmospheric contaminants. The choice between water-clean and no-clean has a profound effect on the process and may also affect subsequent process steps or long-term reliability. Both can be effective oxide strippers for soldering, but there are several considerations for choosing and using the proper flux.

Also referred to as aqueous-clean fluxes or organic acid (OA) fluxes (a misleading term, because most fluxes are organic acid-based), this category contains the most aggressive fluxing agents used for large-scale commercial board assembly. It can consist of strong organic acids, inorganic acids, amines, amino salts, or often a weak organic acid fortified with reactive materials such as halogen salts (Br , F , I , Cl ) that turn acidic during the flux decomposition process. For this reason, as the name implies, this type of flux requires an aqueous wash step to remove any reactive residue traces to avoid corrosion on the PCA.

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